Solder paste is a mixture of flux and powdered solder. The process of attaching electrical components to the contact pads is called reflow soldering. During this process, the controlled heat within SMT reflow soldering oven melts the solder, to connect the joints permanently. Special models are designed to meet high thermal requirements and fine mesh belts for miniature parts.
These devices are designed to provide maximum thermal performance with significantly reduced costs and less space needed. Thanks to the fact everything is computer controlled, there is no possibility for causing thermal damages to especially sensitive components, in any stage. Every device has four or more zones, individually controlled, and larger ones up to ten stages.
In the preheat stage, the solvent in a mixture of flux and powdered solder starts to evaporate. In the next zone, the fluxes are only temporarily joined, but the highest temperature is reached in the third stage. This temperature will depend on the component which is most susceptible to thermal damage.
The final stage of every reflow soldering process is the cooling stage. Gradual cooling is important for achieving the best grain structure of the solder joint, and manufacturers often advice the rate of approximately four degrees per second. Some other similar devices don't include this cooling zone, but experts agree about its importance.
There are different types of SMT soldering ovens, including medium to high volume models, the ones designed as bench top models, and also nitrogen based. Compared to standard devices designed for the same purpose, they provide lower energy consumption and take up less space. Compact and practical, they can find their usage in different processes.
Mid to high volume devices have four independent reflow zones, several thermocouple inputs and LCD touchscreen controls. This type of devices is often used for testing and prototyping. Their stainless steel mesh conveyor accepts up to twenty inch wide boards, and the combination conveyor provides maximum handling flexibility.
On-board computer permits on-screen profiling, and the parameters are set automatically. Particular parameters can be saved to a memory, and reloaded when needed. When re-loaded, all parameters can be additionally adjusted, including upper and lower limits, specific zones temperature settings and conveyor speeds.
These compact sized models provide very good efficiency, easy handling and low consumption of energy. Advanced thermal management options and other innovative possibilities are making them very useful in all types of industries. Safety systems include audible and visual alarms and automatic shutdown options.
Of course, for more advanced manufacturing processes there are some models designed with more heating zones and even more sophisticated controls. Large, ten controlled heating zone SMT oven is designed to meet large manufacturers needs. Equipped with high precision conveyor mechanism and some other innovative solutions, these devices take up small space, but provide excellent results with low energy consumption.
SMT reflow soldering oven is designed to take up less space and to provide excellent results with lower energy consumption. Thanks to efficient pin conveyors, both inline and double sided processing is possible. High quality material is used for all components, to ensure the best performance in high temperature conditions. All devices include battery backup as well.
These devices are designed to provide maximum thermal performance with significantly reduced costs and less space needed. Thanks to the fact everything is computer controlled, there is no possibility for causing thermal damages to especially sensitive components, in any stage. Every device has four or more zones, individually controlled, and larger ones up to ten stages.
In the preheat stage, the solvent in a mixture of flux and powdered solder starts to evaporate. In the next zone, the fluxes are only temporarily joined, but the highest temperature is reached in the third stage. This temperature will depend on the component which is most susceptible to thermal damage.
The final stage of every reflow soldering process is the cooling stage. Gradual cooling is important for achieving the best grain structure of the solder joint, and manufacturers often advice the rate of approximately four degrees per second. Some other similar devices don't include this cooling zone, but experts agree about its importance.
There are different types of SMT soldering ovens, including medium to high volume models, the ones designed as bench top models, and also nitrogen based. Compared to standard devices designed for the same purpose, they provide lower energy consumption and take up less space. Compact and practical, they can find their usage in different processes.
Mid to high volume devices have four independent reflow zones, several thermocouple inputs and LCD touchscreen controls. This type of devices is often used for testing and prototyping. Their stainless steel mesh conveyor accepts up to twenty inch wide boards, and the combination conveyor provides maximum handling flexibility.
On-board computer permits on-screen profiling, and the parameters are set automatically. Particular parameters can be saved to a memory, and reloaded when needed. When re-loaded, all parameters can be additionally adjusted, including upper and lower limits, specific zones temperature settings and conveyor speeds.
These compact sized models provide very good efficiency, easy handling and low consumption of energy. Advanced thermal management options and other innovative possibilities are making them very useful in all types of industries. Safety systems include audible and visual alarms and automatic shutdown options.
Of course, for more advanced manufacturing processes there are some models designed with more heating zones and even more sophisticated controls. Large, ten controlled heating zone SMT oven is designed to meet large manufacturers needs. Equipped with high precision conveyor mechanism and some other innovative solutions, these devices take up small space, but provide excellent results with low energy consumption.
SMT reflow soldering oven is designed to take up less space and to provide excellent results with lower energy consumption. Thanks to efficient pin conveyors, both inline and double sided processing is possible. High quality material is used for all components, to ensure the best performance in high temperature conditions. All devices include battery backup as well.
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